IPC-1752a Generator

Total Parts Plus
E-Mail Address


Requester Information
Company Name
Company Unique ID
Company Unique ID Authority
 
Request Date
Request Document ID
Respond By Date
Internal Supplier ID
Contact Name
Contact Title
Contact Phone
Contact Email
Contact Internal
Contact Street
Contact City
Contact State
Contact Country
Contact Zip Code
Contact Comment
Requester Comments or URL for Additional Information


Supplier Information
Company Name Contact Name Authorized Rep.
Response Doc ID Contact Title Representative Title
Company Unique ID Contact Phone Representative Phone
Unique ID Authority Contact Email     Representative Email  
Response Date   Supplier Comments


Uncertainty Statement


Legal Statement
Legal Declaration   Supplier Acceptance    
 


Product Information
Product
Unit Type
Manufacturing Site
Total Measured Mass
 
 
Item Number Item Name Effective Date Version Requester Item Number Requester Item Name
 


Manufacturing Process Information
Package
MSL Rating
Classification Temp
Max Time Within 5
Component Ramp Up Rate
Component Ramp Down Rate
Preheat Min Temp
Preheat Max Temp
Preheat Duration
Component Temp Spike
Time Above 217
Package Designator
 

Solder
# of Process Cycles
Max Wave Solder Temp
Max Total Wave Time


Terminal
Shape
Size
# Of Instances
Terminal Base Alloy
Bulk Solder Termination
Plating


PSL Rating
Wave
Wave Add Info
Reflow
Reflow Add Info
 


RoHS Exemptions
EL2011/534/EU
EL2011/65/EU_ANNEX_IV
EL2011/534/EU Authority: IPC
Include Exemption ID Description
1 Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
1(a) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes less than 30 W: 3.5 mg
1(b) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes greater than or equal to 30 W and less than 50 W: 3.5 mg
1(c) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes greater than or equal to 50 W and less than 150 W: 5 mg
1(d) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes greater than or equal to 150 W: 15 mg
1(e) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes with circular or square structural shape and tube diameter less than or equal to 17 mm: 7 mg
1(f) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For special purposes: 5 mg
1(g) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):For general lighting purposes less than 30 W with a lifetime equal or above 20,000 h: 3.5 mg
2(a) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):
2(a)(1) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter less than 9 mm (e.g. T2): 4 mg
2(a)(2) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter greater than or equal to 9 mm and less than or equal to 17 mm (e.g. T5): 3 mg
2(a)(3) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter greater than 17 mm and less than or equal to 28 mm (e.g. T8): 3.5 mg
2(a)(4) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter greater than 28 mm (e.g. T12): 5 mg
2(a)(5) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with long lifetime (= 25,000 h): 5 mg
2(b) Mercury in other fluorescent lamps not exceeding (per lamp):
2(b)(1) Mercury in other fluorescent lamps not exceeding (per lamp): Linear halophosphate lamps with tube greater than 28 mm (e.g. T10 and T12): 10 mg
2(b)(2) Mercury in other fluorescent lamps not exceeding (per lamp): Non-linear halophosphate lamps (all diameters): 15 mg
2(b)(3) Mercury in other fluorescent lamps not exceeding (per lamp): Non-linear tri-band phosphor lamps with tube diameter greater than 17 mm (e.g. T9): 15 mg
2(b)(4) Mercury in other fluorescent lamps not exceeding (per lamp): Lamps for other general lighting and special purposes (e.g. induction lamps): 15 mg
3 Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
3(a) Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Short length (less than or equal to 500 mm): 3.5 mg
3(b) Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Medium length (greater than 500 mm and less than or equal to 1500 mm): 5 mg
3(c) Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Long length (greater than 1500 mm): 13 mg
4(a) Mercury in other low pressure discharge lamps (per lamp): 15 mg
4(b) Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60:
4(b)-I Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra greater than 60: P less than or equal to 155 W: 30 mg
4(b)-II Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra greater than 60: 155 W less than P less than or equal to 405 W: 40 mg
4(b)-III Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra greater than 60: P greater than 405 W: 40 mg
4(c) Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):
4(c)-I Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): P less than or equal to 155 W: 25 mg
4(c)-II Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): 155 W less than P less than or equal to 405 W: 30 mg
4(c)-III Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): P greater than 405 W: 40 mg
4(d) Mercury in High Pressure Mercury (vapour) lamps (HPMV)
4(e) Mercury in metal halide lamps (MH)
4(f) Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex
4(g) Mercury in hand crafted luminous discharge tubes used for signs, decorative or architectural and specialist lighting and light-artwork, where the mercury content shall be limited as follows: (a) 20 mg per electrode pair + 0.3 mg per tube length in cm, but not more than 80 mg, for outdoor applications and indoor applications exposed to temperatures below 20 °C; (b) 15 mg per electrode pair + 0.24 mg per tube length in cm, but not more than 80 mg, for all other indoor applications
5(a) Lead in glass of cathode ray tubes
5(b) Lead in glass of fluorescent tubes not exceeding 0.2% by weight
6(a) Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35 % lead by weight
6(b) Lead as an alloying element in aluminium containing up to 0.4% lead by weight
6(c) Copper alloy containing up to 4% lead by weight
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
7(b) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound
7(c)-II Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-III Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
7(c)-IV Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
8(a) Cadmium and its compounds in one shot pellet type thermal cut-offs
8(b) Cadmium and its compounds in electrical contacts
9 Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution
9(b) Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications
11(a) Lead used in C-press compliant pin connector systems
11(b) Lead used in other than C-press compliant pin connector systems
12 Lead as a coating material for the thermal conduction module C-ring
13(a) Lead in white glasses used for optical applications
13(b) Cadmium and lead in filter glasses and glasses used for reflectance standards
14 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
16 Lead in linear incandescent lamps with silicate coated tubes
17 Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications
18(a) Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2 MgSi2O7:Pb)
18(b) Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi 2 O 5 :Pb)
19 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)
20 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)
21 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses
23 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less
24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
25 Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring
26 Lead oxide in the glass envelope of black light blue lamps
27 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers
29 Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC ( 1 )
30 Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more
31 Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting)
32 Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes
33 Lead in solders for the soldering of thin copper wires of 100 micrometer diameter and less in power transformers
34 Lead in cermet-based trimmer potentiometer elements
36 Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display
37 Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body
38 Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide
39 Cadmium in colour converting II-VI LEDs (less than 10 microgram Cd per mm2 of light-emitting area) for use in solid state illumination or display systems
40 Cadmium in photoresistors for analogue optocouplers applied in professional audio equipment
41 Lead in solders and termination finishes of electrical and electronic components and finishes of printed circuit boards used in ignition modules and other electrical and electronic engine control systems, which for technical reasons must be mounted directly on or in the crankcase or cylinder of hand-held combustion engines (classes SH:1, SH:2, SH:3 of Directive 97/68/EC of the European Parliament and of the Council(*)
EL2011/65/EU_ANNEX_IV Authority: IPC
Include Exemption ID Description
1 Lead, cadmium and mercury in detectors for ionising radiation.
1a Lead and cadmium in ion selective electrodes including glass of pH electrodes.
1b Lead anodes in electrochemical oxygen sensors.
1c Lead, cadmium and mercury in infra-red light detectors.
1d Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide.
2 Lead bearings in X-ray tubes.
3 Lead in electromagnetic radiation amplification devices: micro-channel plate and capillary plate.
4 Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons.
5 Lead in shielding for ionising radiation.
6 Lead in X-ray test objects.
7 Lead stearate X-ray diffraction crystals.
8 Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers.
9 Cadmium in helium-cadmium lasers.
10 Lead and cadmium in atomic absorption spectroscopy lamps.
11 Lead in alloys as a superconductor and thermal conductor in MRI.
12 Lead and cadmium in metallic bonds creating superconducting magnetic circuits in MRI, SQUID, NMR (Nuclear Magnetic Resonance) or FTMS (Fourier Transform Mass Spectrometer) detectors.
13 Lead in counterweights.
14 Lead in single crystal piezoelectric materials for ultrasonic transducers.
15 Lead in solders for bonding to ultrasonic transducers.
16 Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments not exceeding 20 mg of mercury per switch or relay.
17 Lead in solders in portable emergency defibrillators.
18 Lead in solders of high performance infrared imaging modules to detect in the range 8-14 micrometer.
19 Lead in Liquid crystal on silicon (LCoS) displays.
20 Cadmium in X-ray measurement filters.
21 Cadmium in phosphor coatings in image intensifiers for X-ray images until 31 December 2019 and in spare parts for X-ray systems placed on the EU market before 1 January 2020.
22 Lead acetate marker for use in stereotactic head frames for use with CT and MRI and in positioning systems for gamma beam and particle therapy equipment.
23 Lead as an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation.
24 Lead enabling vacuum tight connections between aluminium and steel in X-ray image intensifiers.
25 Lead in the surface coatings of pin connector systems requiring nonmagnetic connectors which are used durably at a temperature below -20°C under normal operating and storage conditions.
26 Lead in solders on printed circuit boards, termination coatings of electrical and electronic components and coatings of printed circuit boards, solders for connecting wires and cables, solders connecting transducers and sensors, that are used durably at a temperature below -20°C under normal operating and storage conditions.
27 Lead in solders, termination coatings of electrical and electronic components and printed circuit boards, connections of electrical wires, shields and enclosed connectors, which are used in (a) magnetic fields within the sphere of 1 m radius around the isocenter of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere, or (b) magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy.
28 Lead in solders for mounting cadmium telluride and cadmium zinc telluride digital array detectors to printed circuit boards.
29 Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices (category 8) and/or in industrial monitoring and control instruments.
30 Hexavalent chromium in alkali dispensers used to create photocathodes in X-ray image intensifiers until 31 December 2019 and in spare parts for X-ray systems placed on the EU market before 1 January 2020.
31 Lead, cadmium and hexavalent chromium in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is notified to the consumer.
32 Lead in solders on printed circuit boards of detectors and data acquisition units for Positron Emission Tomographs which are integrated into Magnetic Resonance Imaging equipment.
33 Lead in solders on populated printed circuit boards used in Directive 93/42/EEC class IIa and IIb mobile medical devices other than portable emergency defibrillators. Expires on 30 June 2016 for class IIa and on 31 December 2020 for class IIb.
34 Lead as an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi2O5:Pb) phosphors.


Query List
Query Statement Response
EUROHS-0508 Product Meets EU RoHS Requirements Without Any Exemptions
EUROHS-0508 Product Meets EU RoHS Requirements Except Lead in Solder and This Usage May Qualify Under the Lead in Solder “7b” Exemption (other selected exemptions may apply)
EUROHS-0508 Product Meets EU RoHS Requirements by Application of the Selected Exemption(s)
EUROHS-0508 Product Fails to Meet EU RoHS Requirements
EUROHS-0508 Product is Unknown/Obsolete, No Information is Available
ChinaRoHS-0508 Product(s) requires marking for the presence of restricted substances and must be marked with an Environmental Protection Use Period under China's Measures for Administration of the control of pollution by Electronic Information Products
ChinaRoHS-0508 Product(s) is eligible for marking with the green e code under China's Measures for Administration of the control of pollution by Electronic Information Products
EUREACH-1008 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0110 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0310 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0610 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-1210 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0611 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-1211 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0612 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-1212 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0613 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-1213 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0614 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-1214 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0615 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-1215 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0616 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0117 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0717 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation
EUREACH-0118 Product(s) does not contain EU REACH Candidate List substances above the thresholds specified in the REACH Regulation


Material Summary


Homogeneous Materials
SubProduct SubProduct Mass UnitType # of Instances Material Material Group Material Mass Substance Substance Type CAS EC Level Level Auth Exemption Substance Mass Concentration


Material Groups
Material Group List Authority  
Material Group Mass


E-Mail Address